CIPSA TEC India Pvt. Ltd. Technical Capabilities Sheet

Sl. No.

Parameters

Capabilites

1 Base Laminate Material FR4, CEM 3, Metal clad
2 Board Thickness 0.70 mm To 2.40 mm
3 Layer Count 02 to 08 LAYER
4 Board Finish H A S L - Tin Lead
H A L - Lead Free
E N I G
Carbon & Peelable
5 Finished Copper Thickness 2 oz
6 Minimum Track width & Space
18/18 Micron Base Coper 0.1524 mm [6 Mill]
35/35 Micron Base Coper 0.1778 mm[7 Mill]
70/70 Micron Base Coper 0.2286 mm [9 Mill]
7 Ground To Copper Spacing 0.2032 mm [8 Mill]
8 Minimum Inner Layer Isolation 0.2032 mm [8 Mill]
9 Minimum Finished Hole Size 0.3 mm       [12 Mill]
10 Minimum Annular Ring For Inner & Outer Layer
11 Minimum Epoxy Hatch NO SPECIFIC OF NOW [12 Mils proposed]
12 BARE BOARD TESTING
A). JIG METHOD SPLIT NET TEST POSSIBILITY TO WORK OUT CASE TO CASE
Minimum QFP For Testing 10 X 50 mils Pad with 20 Mils Pitch
Max Test Area [SINGLE SIDED] 440 X 300 mm
Max Test Area [DOUBLE SIDED] 405 X 325 mm
B). FLYING PROBE METHOD
CYCLE TIME & PRICE WILL BE MORE
Minimum QFP For Testing NO LIMITATOIN EXCEPT TIME & COST
Max Test Area [UP TO 1.6 mm] 420 X 350 mm
Max Test Area [1.6 TO 6.0 mm] 520 X 400 mm
13 Minimum SOLDER MASK DAM 4 MILS DAM WITH A GAP OF 10 MILS
14 Maximum Peelable Thickness 300 MICRONS
15 Max Dia can be covered with Peelable 3.0 mm
16 Board Dimension Tolerance +/- 0.15 mm
17 Minimum Slot Width 0.80 mm
18 PTH Tolerance . +0.1/-0..5 mm
19 PRESS FIT TOLERANCE .+/-0.05 mm
20 CARBON TO CARBON SPACING 12 MILS
21 V-SCORE angle 30 DEGREE
22 Web Thickness +/- 0.1 mm
23 GOLD Plating Thickness 0.05 MICRONS
24 Min. Copper Edge To Board Edge 0.20 mm